高效鍍銅光亮劑Cu-912

Efficient Copper Plating brightener Cu-912

特性及優點

Cu-912是一種直流電酸性鍍銅光亮劑，它滿足現今印刷電路板（PCB）分布狀態、熱循環、深鍍能力TP%以及高縱橫比通孔和微孔要求。Cu-912不僅具有高電流密度性能，而且表面分布狀態和深鍍能力均非同一般。與普通直流電鍍光亮劑相比，Cu-912在電鍍速度及鍍層均勻性、鍍層質量等方面有很大的改進，這不僅改善了性能，同時也提高了產量。

Features and Advantages

Cu-912 is a direct current acid coppering brightener. It satisfies the requirement of current PCB distribution status, thermal cycle, throwing power TP% and high aspect ratio through-hole and microhole. Cu-912 boasts not only high current density performance, but also extraordinary surface distribution status and throwing power. Compared with the ordinary direct current electroplating brightener, Cu-912 has great improvement in terms of electroplating speed, plating uniformity and quality, which not only enhances the performance, but boosts the output.

六大核心優勢

Cu-912在電鍍效率、上銅速率、鍍銅均勻性、深鍍能力、延展性和可靠性上的優勢，能為您從容應對生產高難度PCB挑戰時提供強有力的幫助。

Six Core Advantages

The advantages of Cu-912 in electroplating efficiency, copper velocity, copper plating uniformity, throwing power, extensibility and reliability can provide powerful help for you to calmly handle the challenge of producing high difficult PCB

特性分析

Cu-912鍍銅憑借其良好的延展性、低熱張力、低內應力等物理特性達到優秀抗熱沖擊特質，增加了鍍通孔的可靠性，在焊接溫度達到250°C以上的無鉛裝配焊接也表現得極為出色。

Cu-912已通過了一系列嚴格的OEM和特殊工業熱沖擊與熱循環測試。

Feature Analysis

Cu-912 coppering boasts excellent thermal shock resistance by means of those physical characteristics as favorable extensibility, low thermal tension, and low internal stress, which strengthens PTH reliability. When soldering temperature reaches over 250℃,  it also has outstanding performance in lead free assembly soldering.

Cu-912 has passed a series of strict OEM, special industrial thermal shock and thermal cycling test.

通孔能力

Cu-912與其他同類型深鍍能力對比圖

鍍銅添加劑決定鍍通孔深鍍性的高低，而深鍍能力的高低對電鍍品質有至關重要的影響。

Comparison Diagram of Cu-912 and Other Same Type in Throwing Power

Copper plating additive determines the height of plated-through-hole throwing power while throwing power height has crucial influence on electroplating quality.

(左圖為：2.2mm厚PCB不同孔徑深鍍能力對比）

(Left Figure: 2.2mm thick  PCB, different aperture throwing power comparison)

超強的深鍍能力將帶來電鍍工序多方面的提升。

Strong throwing power brings manifold improvements for electroplating procedure.

同時，Cu-912的高性能也能幫助在電鍍成本控制方面做到極致。

Part in electropating cost control.